#AI2T starts today at Stanford! Tignis co-founder Jon Herlocker joins industrial tech leaders to share how AI + digital twins are reshaping manufacturing. 🔗 bit.ly/4mnRWHK Semiconductor Engineering @SIA

Tignis GM Jon Herlocker keynotes at SEMI’s Agentic AI event on June 11 in Milpitas. Don’t miss this look at AI’s future in fabs. SEMI 🔗 bit.ly/3GZFsWK

Tignis co-founder Jon Herlocker is keynoting at SEMI’s #AgenticAI event June 11–12 in Milpitas. Don’t miss it. SEMI @SIA

Labor crunch meets AI. David Park of Tignis says: “Fabs must do more with less. AI makes that possible.” More from Semiconductor Engineering 👉 semiengineering.com/packaging-with… #Semiconductor #AI #AdvancedPackaging #DoMoreWithLess

Can agentic AI reshape fabs? Jon Herlocker's keynote shares a practical roadmap on June 11 at #AgenticAI. Learn more here: 🔗 bit.ly/3GZFsWK SEMI @SIA

Thanks to AYNA and Stanford for a great A12T event! Tignis co-founder, Jon Herlocker, was honored to join the panel on AI/ML in semiconductors. Did you miss it? Learn more at bit.ly/4kOZb9W. #AI #ML #SmartManufacturing #Semiconductors #A12T

Jon Herlocker speaks tomorrow at #AgenticAI! Join us June 11 at 1:30 PM for insights on RL + IPC in fabs. 🔗 bit.ly/3GZFsWK SEMI @SIA

Today at 1:30 PM: Jon Herlocker keynotes at #AgenticAI on how software agents will transform fabs. SEMI @SIA

“Thin-film accuracy is non-negotiable.” — David Park, VP Marketing at Tignis As stack complexity grows, real-time AI insight helps fabs stay precise. Read the Semiconductor Engineering article: bit.ly/4kksi5d #DoMoreWithLess

AI needs clean, contextualized data to deliver real value in fabs. Tignis' Boyd Finlay says, “Without a data strategy, AI will stay in pilot mode.” Read more in Semiconductor Engineering: bit.ly/409rd8d #DoMoreWithLess @SIA

Looking forward to attending the Q3 Fab Owners Alliance (FOA) meeting in Beaverton, Oregon and discussing challenges and creative solutions in our industry. We hope to see you there!

The Tignis, Inc. team recently gathered for an energizing team-building event at a Dungeons & Dragons-themed restaurant! Alongside great food, we explored strategic data analytics and strengthened collaboration in an imaginative setting. A perfect blend of brainstorming & adventure

The promise, reality, and evolution of AI in semiconductor manufacturing. semiengineering.com/ai-from-a-to-z/ #semiconductor #AI #semiconductormanufacturing #LLMs Tignis, Inc. #DL #ML #AgenticAI

Machine Learning In Semiconductor Manufacturing: How advances and limitations are defined by the data. semiengineering.com/machine-learni… #semiconductor #semiconductormanufacturing #AI Tignis, Inc. Cohu, Inc.

Machine learning is the foundation for nearly all the advancements in AI. Jon Herlocker, VP & GM of Tignis, Inc. , A Cohu, Inc. Analytics Solution, talks with Semiconductor Engineering about what can go wrong in gathering and applying data. Watch the full video here: cohu.com/tignis/machine…

Classic fault detection is slow and reactive—leading to scrap. Unsupervised ML can predict failures. JonHerlocker of Tignis, Inc., a Cohu, Inc. analytics solution, explains why supervised FDC isn’t enough. Watch: youtu.be/sv6CruAMv_E

Cohu, Inc. and Tignis, Inc. will be at SEMI West, October 7–9. Hear Boyd Finlay discuss Smart Manufacturing and ML & Ian Mazsa as a Keynote Speaker for Silicon Photonics at the Test Vision Symposium. Explore AI-powered process optimization at booth SM10. We’d love to connect!

We’re at SEMICON West! Visit Cohu, Inc. and Tignis, Inc. at booth SM10 in the Smart Manufacturing Pavilion. Boyd F. kicked things off with a great talk on digital twins + ML & we're looking forward to Ian Mazsa’s keynote on the future of test & back-end manufacturing. Let’s connect!

Virtual metrology may never be 100% perfect. Jon Herlocker, VP & GM of Tignis, Inc., A Cohu, Inc. Analytics Solution, talks with Semiconductor Engineering about why virtual metrology will never completely replace metrology tools in semiconductor fabs. Visit: cohu.com/tignis/virtual…

How is AI reshaping semiconductor packaging? Jon Herlocker & Boyd Finlay of Tignis, Inc., a Cohu, Inc. Analytics Solution, share insights in Semiconductor Engineering. From transfer learning to predictive maintenance—AI is redefining yield. Read the full article at: semiengineering.com/smarter-packag…