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Micross Components

@microsscomps

Bare Die #Semiconductor #Microelectronics #Packaging #Test #Wafer #Processing #Bumping #BGA #CGA #Component #Robotic #Solder Dip #Silicon #Turnkey #Solutions

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linkhttp://www.micross.com calendar_today12-10-2012 15:20:15

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Missed our webinar? The recording is now available! Designing & optimizing hi-rel electronics while maintaining production/material support has become increasingly challenging, but there are many solutions. Industry experts, share their insights. View: bit.ly/3AeZyXp

Missed our webinar? The recording is now available!

Designing & optimizing hi-rel electronics while maintaining production/material support has become increasingly challenging, but there are many solutions. Industry experts, share their insights. 

View: bit.ly/3AeZyXp