Micross Components (@microsscomps) 's Twitter Profile
Micross Components

@microsscomps

Bare Die #Semiconductor #Microelectronics #Packaging #Test #Wafer #Processing #Bumping #BGA #CGA #Component #Robotic #Solder Dip #Silicon #Turnkey #Solutions

ID: 875833232

linkhttp://www.micross.com calendar_today12-10-2012 15:20:15

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Micross Components
@microsscomps

3 years ago

Designing hi-rel electronics and being able to maintain system production or material support beyond planned program life has become an increasingly challenging endeavor. Please join us on July 7th at 1PM EDT to learn the latest design options. Register: bit.ly/3AeZyXp

Designing hi-rel electronics and being able to maintain system production or material support beyond planned program life has become an increasingly challenging endeavor. Please join us on July 7th at 1PM EDT to learn the latest design options. Register: bit.ly/3AeZyXp