A full page cover story about Zhen Ding (4958 TT) and its chairman Charles Shen at Commercial Times today. How he is committed to be the TSMC like in the PCB industry despite Zhen Ding has been the world’s largest PCB manufacturer already.

#ZhenDing#4958TT#ICSubstrates

#digitalisierung eröffnung der #ats #icsubstrates werkes in chongqing. Erstes substratewerk in china.

Discover our advanced interconnect metallization processes at the IMAPS Device Packaging Conference & Expo. Visit our booth 31-32 to learn more about our extensive leadframe product portfolio. bit.ly/41UqN4Y #advancedmetallization #devicepackaging #icsubstrates

Our portfolio of solutions for creation of advanced circuitry in package substrates is helping the industry to solve key challenges facing the next generation of electronic devices. #icsubstrates #pcb #enig Learn More: bit.ly/3IPfhgN

Success of CHIPS Act depends on quickly establishing a pilot facility for integrated circuit substrates according to a new industry report from IPC’s Chief Technologist Council. Read report: hubs.li/Q01GNKTm0 #ChipsAct #ICSubstrates #ChipsforAmerica #IntegratedCircuits

Why #HDI and Ultra #HDI ? Join IPC Hall of Famer Mike Carano for a webinar “ #HDI /Ultra HDI: #ICSubstrates and #AdvancedPackaging , on March 29. #BuildElectronicsBetter hubs.li/Q01DXRcS0

How will direct metallization deliver #sustainability gains across the #supplychain ? We’re eager to hear from Leslie Kim, MacDermid Alpha Electronics Solutions, when he presents at the IPC High Reliability Forum. #ICsubstrates #DM #PCB #fabrication #sustainability hubs.li/Q01_C0v90

If cost-competitive #ICsubstrates are available from U.S. suppliers, the domestic #electronicsmanufacturing industry will buy them, according to IPC’s #advancedpackaging report, “Towards a Robust Advanced Packaging Ecosystem” hubs.li/Q01r93XS0

IPC welcomes President Biden's “presidential determination” to prioritize the domestic development of #printedcircuitboards (PCBs) and #semiconductor #advancedpackaging , including #ICsubstrates , under Title III of the Defense Production Act (DPA). News release: hubs.li/Q01JhGly0

Advanced IC Substrates Market will reach US$ 16,953.8 million by 2031 growing by 7.3% annually over 2022-2031.

Read More @ bit.ly/3IERNxt

Key Players: TTM Fujitsu Global KYOCERA Global 성광장

#icsubstrates #electronics #marketresearch #lucidmarketreports

New Single Step Copper Through-Hole Filling Process to Improve IC Substrate Designs
Read More: ow.ly/QQVA50zmedT

MacDermid Alpha Electronics Solutions #throughholefilling #metallization #copper throughhole #copper #substrates #ICsubstrates #PCBlayers #electroplating #copper electroplating

Austrian microelectronics firm AT&S secures €250m funding from European Investment Bank news.europawire.eu/austrian-micro… #microchips #printedcircuitboards #ICsubstrates European Investment Bank

This announcement is a sign that IPC’s message is getting through: that any nation or bloc hoping to rebuild its domestic #microelectronics industry needs to take a broader, “silicon-to-systems” approach that includes #printedcircuitboards , #ICsubstrates , and #advancedpackaging .

#digitalisierung Der Leiterplattenhersteller AT&S steigt in die innovative #icsubstrates Produktion ein. goo.gl/eb0c4V @ATS_IR_PR

EANS-Adhoc: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft / AT&S decides further expansion of the IC Substrates division with an investment volume of approximately € 200 million brandaktuell.at/2021/03/24/pol…