UMC x Polar Semiconductor: A Strategic Move for U.S. Onshore Chip Production UMC and Polar Semiconductor just announced a new collaboration to explore U.S. onshore manufacturing of power and sensor chips—core components for automotive, data centers, industrial systems, and other

Amazing

Use math

Fluxless TCB and Hybrid Bonding are not direct competitors, but rather complementary solutions tailored to different packaging contexts and material requirements. TSMC’s strategy in CoWoS-L shows that for cases where tin bump usage is still necessary, fluxless TCB—when combined

Accelerating Die Attach Innovation for Multi-Chip Systems: From Monolithic Integration to 3D Chiplet Packaging As Moore’s Law slows and process costs surge, semiconductor design has shifted from monolithic SoC architectures to modular, chiplet-based systems. While this evolution

TIMs have evolved from being a passive supporting layer to a critical enabler for system stability in AI processors, high-performance computing (HPC), and next-generation advanced packaging. As chip power densities exceed 2 W/mm², local hot spots surge beyond 100°C, and

#NVIDIA now has more cash than it can realistically spend. Foreign media point out that the AI giant’s biggest headache is having over $60 billion in cash on its balance sheet. To accelerate the pace of deploying that capital, the company has been aggressively investing in tech

Server?!

Custom accelerators are set to surpass GPUs in units shipped by 2028. This marks a profound shift in semiconductor design as AI demand drives the rise of tailored silicon. Slide from #Marvell

Marvell + Celestial AI 👍 open.substack.com/pub/tspasemico…

What is tiny car?

AI and HPC Driving 2.5D/3D Packaging The demand for AI and high-performance computing (HPC) is accelerating adoption of 2.5D/3D packaging and HBM memory, with Hybrid Bonding and Thermo-Compression Bonding (TCB) emerging as critical technologies. Solutions such as CoWoS and SoIC

In recent research from Intel, a hybrid TIM architecture was introduced—combining liquid metal at the center and conformable silicone-based adhesive TIM around the periphery. This design doesn't rely solely on raw material specs but uses thermal and mechanical co-simulation to

In contrast, TSMC’s mainstream approach reflects a different thermal philosophy: relying on mature polymer TIMs and process stability, while Intel pursues breakthroughs through heterogeneous material combinations and interface-level control. On platforms like CoWoS, InFO, and

Nurse Robot

🔴If you want to know why building a fab in the U.S. is so difficult, the latest New York Times report on #TSMC Arizona says it all. The article reveals the brutal reality behind America’s “Made in USA” dream: even with money and land, the U.S. lacks the industrial muscle memory